ВЛИЯНИЕ ТЕПЛОФИЗИЧЕСКИХ СВОЙСТВ ЖИДКОСТЕЙ НА КОНВЕКТИВНЫЙ ТЕПЛОПЕРЕНОС В ЭЛЕКТРОННЫХ УСТРОЙСТВАХ

Влияние соотношения сторон корпуса и различных теплофизических свойств жидкостей на теплопередачу было исследовано в прямоугольном корпусе с массивом микросхем размером 3х3, установленных заподлицо, размещенных на передней вертикальной стенке с постоянной температурой и охлаждаемых противоположной стенкой. Для изучения теплопередачи внутри корпуса было проведено моделирование для четырех соотношений сторон корпуса (A=1.0, 5.0, 7.5, 20.0) и пяти различных сред (воздух, вода, FC-40, FC-72, FC-88). Численные результаты показывают, что самые высокие скорости наблюдаются в воздухе, в то время как низкие скорости были замечены в воде и в трех диэлектрических жидкостях FC-40, FC-72, FC-88. Максимальные скорости воздуха для компонента W получены на высоте Z= 5.5. Замечено, что при уменьшении соотношения сторон корпуса скорость потока жидкости увеличивается. Максимальное число Nu было обнаружено, когда корпус был заполнен диэлектрическими жидкостями FC-72 и FC-88, а минимальное – в воздухе. Чтобы убедиться в том, что выбранные численные методы, компьютерная программа были реализованы корректно, была выполнена тестовая задача. Между результатами обнаружено хорошее соответствие.

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