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<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">kaz29</journal-id><journal-title-group><journal-title xml:lang="ru">Вестник Казахстанско-Британского технического университета</journal-title><trans-title-group xml:lang="en"><trans-title>Herald of the Kazakh-British Technical University</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">1998-6688</issn><issn pub-type="epub">2959-8109</issn><publisher><publisher-name>Казахстанско-Британский Технический Университет</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.55452/1998-6688-2023-20-3-26-37</article-id><article-id custom-type="elpub" pub-id-type="custom">kaz29-761</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>МАТЕМАТИЧЕСКИЕ НАУКИ</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>MATHEMATICAL SCIENCES</subject></subj-group></article-categories><title-group><article-title>ВЛИЯНИЕ ТЕПЛОФИЗИЧЕСКИХ СВОЙСТВ ЖИДКОСТЕЙ НА КОНВЕКТИВНЫЙ ТЕПЛОПЕРЕНОС В ЭЛЕКТРОННЫХ УСТРОЙСТВАХ</article-title><trans-title-group xml:lang="en"><trans-title>THE EFFECT OF THERMOPHYSIZAL PROPERTIES OF FLUIDS ON CONVECTIVE HEAT TRANSFER IN ELECTRONIC DEVICES</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><contrib-id contrib-id-type="orcid">https://orcid.org/0000-0002-1937-8615</contrib-id><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Исахов</surname><given-names>А. А.</given-names></name><name name-style="western" xml:lang="en"><surname>Issakhov</surname><given-names>А. А.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Исахов Алибек Абдиашимович, Доктор PhD, профессор Школы прикладной математики</p><p>ул. Толе би, 59, 050000, г. Алматы</p></bio><bio xml:lang="en"><p>Issakhov Alibek Abdiashimovich, Doctor PhD, Professor of of School of Applied Mathematics</p><p>59, Tole bi street, Almaty, 050000</p></bio><email xlink:type="simple">al.isakhov@kbtu.kz</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><contrib-id contrib-id-type="orcid">https://orcid.org/0009-0006-3522-8656</contrib-id><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Байбатырова</surname><given-names>К. Е.</given-names></name><name name-style="western" xml:lang="en"><surname>Baibatyrova</surname><given-names>К. Е.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Байбатырова Камилла Ермековна, Магистрант, Школа прикладной математики</p><p>ул. Толе би, 59, 050000, г. Алматы</p></bio><bio xml:lang="en"><p>Baibatyrova Kamilla Ermekovna, Master Student, School of Applied Mathematics</p><p>59, Tole bi street, Almaty, 050000</p></bio><email xlink:type="simple">k_baibatyrova@kbtu.kz</email><xref ref-type="aff" rid="aff-1"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru">Казахстанско-Британский технический университет<country>Казахстан</country></aff><aff xml:lang="en">Kazakh-British Technical University<country>Kazakhstan</country></aff></aff-alternatives><pub-date pub-type="collection"><year>2023</year></pub-date><pub-date pub-type="epub"><day>01</day><month>10</month><year>2023</year></pub-date><volume>20</volume><issue>3</issue><fpage>26</fpage><lpage>37</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Исахов А.А., Байбатырова К.Е., 2023</copyright-statement><copyright-year>2023</copyright-year><copyright-holder xml:lang="ru">Исахов А.А., Байбатырова К.Е.</copyright-holder><copyright-holder xml:lang="en">Issakhov А.А., Baibatyrova К.Е.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://vestnik.kbtu.edu.kz/jour/article/view/761">https://vestnik.kbtu.edu.kz/jour/article/view/761</self-uri><abstract><p>Влияние соотношения сторон корпуса и различных теплофизических свойств жидкостей на теплопередачу было исследовано в прямоугольном корпусе с массивом микросхем размером 3х3, установленных заподлицо, размещенных на передней вертикальной стенке с постоянной температурой и охлаждаемых противоположной стенкой. Для изучения теплопередачи внутри корпуса было проведено моделирование для четырех соотношений сторон корпуса (A=1.0, 5.0, 7.5, 20.0) и пяти различных сред (воздух, вода, FC-40, FC-72, FC-88). Численные результаты показывают, что самые высокие скорости наблюдаются в воздухе, в то время как низкие скорости были замечены в воде и в трех диэлектрических жидкостях FC-40, FC-72, FC-88. Максимальные скорости воздуха для компонента W получены на высоте Z= 5.5. Замечено, что при уменьшении соотношения сторон корпуса скорость потока жидкости увеличивается. Максимальное число Nu было обнаружено, когда корпус был заполнен диэлектрическими жидкостями FC-72 и FC-88, а минимальное – в воздухе. Чтобы убедиться в том, что выбранные численные методы, компьютерная программа были реализованы корректно, была выполнена тестовая задача. Между результатами обнаружено хорошее соответствие.</p></abstract><trans-abstract xml:lang="en"><p>The impact of enclosure aspect ratio and different thermophysical properties of fluids on heat transfer were investigated in rectangular enclosure with 3x3 array of flush-mounted chips placed on the front vertical wall with constant temperature and cooled by the opposite wall. To study heat transfer inside the enclosure simulations were done for four enclosure aspect ratios(A=1.0, 5.0, 7.5, 20.0) and five fluids(air, water, FC-40, FC-72, FC-88). Numerical results show that the highest velocities are in the air while low velocities have been noticed in the water, FC-40, FC-72, FC-88. The maximum air velocities for the W component are obtained precisely at a height of Z= 5.5. It is observed that when enclosure aspect ratio decreases, the fluid velocity increases. Maximum Nu number was when enclosure was filled with dielectric fluids FC-72 and FC-88, and minimal was found in the air. To ensure that chosen numerical methods, computer program was implemented correctly test task were completed. Good agreement is found between the results.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>теплопередача</kwd><kwd>микросхемы</kwd><kwd>соотношение сторон</kwd><kwd>теплофизические свойства жидкостей</kwd><kwd>диэлектрические жидкости</kwd></kwd-group><kwd-group xml:lang="en"><kwd>convective heat transfer</kwd><kwd>IC chips</kwd><kwd>enclosure aspect ratio</kwd><kwd>thermophysical properties of fluids</kwd><kwd>dielectric liquids</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Murshed S.M.S. Electronic Cooling, An Overview, Intechopen, 2016. ISBN-13: 978-953-51-2406-1.</mixed-citation><mixed-citation xml:lang="en">Murshed S.M.S. Electronic Cooling, An Overview, Intechopen, 2016. 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