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<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">kaz29</journal-id><journal-title-group><journal-title xml:lang="ru">Вестник Казахстанско-Британского технического университета</journal-title><trans-title-group xml:lang="en"><trans-title>Herald of the Kazakh-British Technical University</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">1998-6688</issn><issn pub-type="epub">2959-8109</issn><publisher><publisher-name>Казахстанско-Британский Технический Университет</publisher-name></publisher></journal-meta><article-meta><article-id custom-type="elpub" pub-id-type="custom">kaz29-38</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>ФИЗИКО-МАТЕМАТИЧЕСКИЕ И ТЕХНИЧЕСКИЕ НАУКИ</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>PHYSICAL, MATHEMATICAL AND TECHNICAL SCIENCES</subject></subj-group></article-categories><title-group><article-title>КОМПЬЮТЕРНОЕ МОДЕЛИРОВАНИЕ ВЗАИМОДЕЙСТВИЙ ЧАСТИЦА-ПОВЕРХНОСТЬ ТВЕРДОГО ТЕЛА</article-title><trans-title-group xml:lang="en"><trans-title>COMPUTER SIMULATION OF PARTICLE- SOLID SURFACE INTERACTIONS</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Умаров</surname><given-names>Ф. Ф.</given-names></name><name name-style="western" xml:lang="en"><surname>Umarov</surname><given-names>F. F.</given-names></name></name-alternatives><bio xml:lang="ru"><p>д.ф.-м.н., профессор</p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Джурахалов</surname><given-names>А. А.</given-names></name><name name-style="western" xml:lang="en"><surname>Dzhurakhalov</surname><given-names>A. A.</given-names></name></name-alternatives><bio xml:lang="ru"><p>д.ф.-м.н., профессор</p></bio><xref ref-type="aff" rid="aff-2"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Расулов</surname><given-names>А. М.</given-names></name><name name-style="western" xml:lang="en"><surname>Rasulov</surname><given-names>A. M.</given-names></name></name-alternatives><bio xml:lang="ru"><p>д.ф.-м.н., профессор</p></bio><xref ref-type="aff" rid="aff-3"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Ядгаров</surname><given-names>И. Д.</given-names></name><name name-style="western" xml:lang="en"><surname>Yadgarov</surname><given-names>I. D.</given-names></name></name-alternatives><bio xml:lang="ru"><p>д.ф.-м.н.</p></bio><xref ref-type="aff" rid="aff-4"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru">АО "Казахстанско-Британский технический университет"<country>Казахстан</country></aff><aff xml:lang="en">Kazakh-British Technical University<country>Kazakhstan</country></aff></aff-alternatives><aff-alternatives id="aff-2"><aff xml:lang="ru">Университет Антверпена<country>Бельгия</country></aff><aff xml:lang="en">University of Antwerpen<country>Belgium</country></aff></aff-alternatives><aff-alternatives id="aff-3"><aff xml:lang="ru">Ферганский Политехнический институт<country>Узбекистан</country></aff><aff xml:lang="en">Ferghana Polytechnical University<country>Uzbekistan</country></aff></aff-alternatives><aff-alternatives id="aff-4"><aff xml:lang="ru">Институт ионно-плазменных и лазерных технологий Академии наук Республики Узбекистан<country>Узбекистан</country></aff><aff xml:lang="en">Institute of Ion-Plasma and Laser Technologies<country>Uzbekistan</country></aff></aff-alternatives><pub-date pub-type="collection"><year>2020</year></pub-date><pub-date pub-type="epub"><day>02</day><month>11</month><year>2021</year></pub-date><volume>17</volume><issue>1</issue><fpage>180</fpage><lpage>194</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Умаров Ф.Ф., Джурахалов А.А., Расулов А.М., Ядгаров И.Д., 2021</copyright-statement><copyright-year>2021</copyright-year><copyright-holder xml:lang="ru">Умаров Ф.Ф., Джурахалов А.А., Расулов А.М., Ядгаров И.Д.</copyright-holder><copyright-holder xml:lang="en">Umarov F.F., Dzhurakhalov A.A., Rasulov A.M., Yadgarov I.D.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://vestnik.kbtu.edu.kz/jour/article/view/38">https://vestnik.kbtu.edu.kz/jour/article/view/38</self-uri><abstract><p>В работе с помощью различных методов компьютерного моделирования (приближение парных столкновений, молекулярная динамика, потенциал модели встроенного атома, метод минимизации энергии) исследованы особенности некоторых процессов (ионное рассеяние, распыление, имплантация в условиях каналирования, а также осаждение нанокластеров и рост тонких пленок), сопровождающих взаимодействие частиц с поверхностью твердого тела. Процессы рассеяния и распыления при скользящей ионной бомбардировке поверхностей монокристаллов Si(001), SiC(001), Cu3Au(001), Ni(100) иCu(100) ионами Ar+ и Ne+ с энергиями 0.5-5 кэВ и их возможное применение для диагностики и модификации поверхности исследованы компьютерным моделированием в приближении парных столкновений. Ионная имплантация при нормальном и скользящем падении на поверхность исследована в приближении парных столкновений. Исследованы профили распределения каналированных при имплантации ионов в зависимости от типа кристаллической решетки, сорта ионов и их энергии. Показано, что каналирование низкоэнергетических ионов сквозь тонкие монокристаллические металлические пленки можно использовать для определения сорта и мест адсорбции легких атомов, адсорбированных на тыльной поверхности пленки. Установлено, что для параксиальной части пучка основной вклад в полные потери энергии вносят неупругие потери. Установлено, что потери энергии ионов, прошедших тонкие кристаллы и профили распределения по глубине зависят от ширины канала и соотношения масс сталкивающихся частиц. Осаждение нанокластеров AgnCom на поверхность Ag(100) и рост тонкой пленки исследованы в атомном масштабе методом классической молекулярной динамики. Показано, что метод потенциал модели встроенного атома можно успешно использовать для исследования осаждения нанокластеров AgnCom на поверхность Ag(100) при энергиях осаждения (0.25 eV – 1.5 эВна/атом). Адсорбция фуллерена C60 на поверхность и края, свободного от дефектов графена, исследована компьютерным моделированием в рамках классической молекулярной динамики. Компьютерная модель одного свободного от дефектов фуллерена построена методом минимизации энергии с использованием потенциала Бреннера второго поколения. Определены энергии связи каждого атома углерода в фуллерене. Установлено, что фуллерен лучше адсорбируется на крае кресла графена и хуже – на его «угловых» атомах.</p></abstract><trans-abstract xml:lang="en"><p>In this work the peculiarities of the some processes (ion scattering, sputtering and implantation at channeling conditions as well as nanoclusters deposition and thin film growth) accompanying the particle-solid surface interactions has been investigated by different computer simulation methods (binary collision approximation, molecular dynamics,embedded atom model potential, energy minimization method).The scattering and sputtering processes at 0.5-5 keVArand Ne ions grazing bombardment of Si(001), SiC(001), Cu3Au(001), Ni(100) and Cu(100) surfaces and their possible application for the surface diagnostics and modification have been studied by computer simulation in binary collision approximation. Ion implantation at normal as well as at glancing incidence is carried out by computer simulation in binary collision approximation. Profiles of the distribution of channeled ions at implantation have been calculated depending on crystal lattice type, kind of ions and their energy. It has been shown that the channeling of low-energy ions through thin single crystal metal films can be used to determine the sort and adsorption site of light atoms adsorbed on a clean rear surface. It is shown that for paraxial part of a beam the main contribution to the total energy losses comes from inelastic ones. It has been established that the energy losses of ions transmitted trough thin crystal and depth profile distributions depend on width of the channel and mass ratio of colliding atoms. The deposition of bi-metallic AgnCom nanoclusters on Ag(100) surface and thin film growth have been studied at the atomic scale by means of classical molecular dynamics simulation. It was shown that the embedded atom model potential may be used successfully for studying of AgnCom nanocluster deposition on Ag(100) surface at the slowing down energies (0.25 eV – 1.5 eV per/atom). The adsorption of fullerene C60 onto the surface and edges of defect-free graphene was studied by computer simulation within the framework of classical molecular dynamics. The computer model of a single defect-free C60 fullerene was built by the energy minimization method using the second-generation Brenner potential (REBO) and the cohesive energy of each carbon atom in the fullerene was determined. It was established that the fullerene is better adsorbed on the armchair edge of graphene and worst on the its “corner” atoms.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>ионное рассеяние</kwd><kwd>коэффициент распыления</kwd><kwd>послойное распыление</kwd><kwd>ионная имплантация</kwd><kwd>ионное каналирование</kwd><kwd>монокристаллы металлов и полупроводников</kwd><kwd>профили распределения</kwd><kwd>компьютерное моделирование</kwd><kwd>наноразмерные материалы</kwd><kwd>осаждение кластеров</kwd><kwd>рост тонких пленок</kwd><kwd>фуллерен</kwd><kwd>графен</kwd><kwd>адсорбция</kwd></kwd-group><kwd-group xml:lang="en"><kwd>ion scattering</kwd><kwd>sputtering yield</kwd><kwd>layer-by-layer sputtering</kwd><kwd>ion implantation</kwd><kwd>ion channeling</kwd><kwd>metal and semiconductor single crystals</kwd><kwd>profile of distribution</kwd><kwd>computer modeling and simulation</kwd><kwd>nanoscale materials</kwd><kwd>clusters deposition</kwd><kwd>thin film growth</kwd><kwd>fullerene</kwd><kwd>graphene</kwd><kwd>adsorption</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Van Hove M.A. Surf. 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